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Production
Capability
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The development of our management system has proceeded
through different stages in order to ensure efficient design
and control. Every workflow was analyzed in order
to determine which activities needed control and
estimate specific risks for each activity. Based on the
results we designed required routines. |
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Layer count |
1 Layer - over 24 Layer |
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Blind via Hole |
yes |
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Buried hole |
yes |
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HDI – Filled copper |
yes |
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Surface Finish |
Electroplating Gold flash
ENIG
Hot- Air- Leveling (Sn/Pb and LF HAL)
OSP
Immersion Silver Immersion Tin |
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Available laminate |
CEM-1, CEM-3, FR-4
Getek, PTFE, 25FR
FR4 + 25FR
FR4 + Getek
FR4 + PTFE
Rogers - Megtron
Polyclad - Aluminum |
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Material supplier
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Shengyi, Isola, Arlon,
King Board, TUC, Taconic, Totking, Nelco, ITEQ |
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Feature |
Condition |
Production |
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Structure |
Board Thickness |
Minimum |
8 mil |
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Maximum |
120 mil |
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Sequential Build-Up |
1+N+1/2+N+2 3+N+3 |
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Sequential Lamination |
N+N,N+N (Microvia) |
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Via in Pad |
Filled by Cu Paste |
YES |
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Capped PTH |
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YES |
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Laser Via filling |
Filled by Cu Paste |
YES |
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Filled by Plating |
YES |
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Copper Foil |
Outer Layer |
1/3 oz – 5 oz |
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Inner Layer |
1/3 oz – 3 oz |
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Solder Mask |
Solder Mask Dam |
Minimum |
3 mil |
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Solder Mask Opening |
Minimum |
1.5 mil |
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Dielectric Thick. |
SBU Dielectric Thickness |
Minimum |
1.5 mil |
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Maximum |
5 mil |
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IVH Core Thickness |
Minimum |
4 mil |
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Maximum |
100 mil |
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Core Thickness |
Minimum |
2 mil |
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Dielectric Thickness (Prepre) |
Minimum |
2 mil |
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Hole Formation |
Mechanical Hole |
Minimum |
6 mil |
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IVH Hole Size |
Maximum |
16 mil |
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Laser Hole Drill Size |
Minimum |
3 mil |
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Maximum |
8 mil |
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Pad Size (Mechanical Hole) |
Inner Layer |
Drill + 8 mil |
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Outer Layer |
Drill size + 6 mil |
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Inner Layer Clearance |
Drill size + 12 mil |
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Pad Size (Laser Hole) |
Target Pad |
Drill Size + 6 mil |
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Capture Pad |
Drill Size + 6 mil |
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Feature |
Condition |
Production |
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Dimension Toler. |
Board Thickness |
≤ 20mil |
+/- 2 mil |
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> 20mil |
+/- 10% |
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Bow & Twist |
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0.75% |
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Fiducial Mark to Fiducial Mark |
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+/- 1.5 mil |
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Hole to Hole |
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+/- 3 mil |
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Hole to Edge |
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+/- 5 mil |
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Edge to Edge |
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+/- 4 mil |
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Laser process |
CO2 Direct Drill |
Conform Mask |
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Registration Cap.
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Layer to Layer |
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3 mil |
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Electrical/RF Cap. |
Min. Line Width/Spacing |
Inner Layer (1/2oz) |
2mil / 3mil |
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Inner Layer (1oz)
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3mil / 3mil |
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Outer Layer |
3mil / 3mil |
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Impedance Control |
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+/- 10% |
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Plating Capability |
Aspect Ratio |
Mechanical Through Hole |
12:1 |
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(Depth:Diameter) |
Laser Blind Via |
1:1 |
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Unfortunately, PCBs cannot simply be bought off the shelf. If you
are aware of the many stages required in the production of a PCB,
you will know that it is indeed a long and complex process.
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1. |
Filmwork |
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13. |
Etching |
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2. |
Material preparation |
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14. |
Quality Control |
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3. |
Mounting holes & pinning |
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15. |
Tin Strip |
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4. |
CNC drilling |
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16. |
Brushing / Copper plating |
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5. |
Brushing plating |
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17. |
Soldermask application |
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6. |
Electroless copper plating |
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18. |
Soldermask exposure |
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7. |
Brushing / resist |
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19. |
Soldermask development |
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8. |
Laminating resist |
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20. |
Burn in |
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9. |
Exposing resist |
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21. |
Hot Air Levelling |
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10. |
Developing resist |
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22. |
Pinning |
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11. |
Tin lead Plating |
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23. |
Routing |
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12. |
Drying |
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24. |
Final quality checks |
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